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Fix nested tooling pin for signed release preparation - #281

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ODevStudio merged 1 commit into
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odev/fix-signed-release-build-tooling
Nov 8, 2026
Merged

ODevStudio merged 1 commit into
mainfrom
odev/fix-signed-release-build-tooling

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Cause

Signed release run 42515351965 passed its preflights but failed before creating assets. The signing job omitted the existing pioarduino constraint, allowing nested Core 6.2.0.post1 to replace SCons during the build and fail importing SCons.Tool.FortranCommon.

Fix

Reuse the same job-level UV_CONSTRAINT as the successful nightly/custom jobs, plus a focused release-workflow regression assertion. No dependency upgrade, firmware behavior, signing policy, or security-setting change.

Validation And Release Identity

Focused release-workflow contract and raw whitespace checks passed locally. Require independent reviewer-agent review and relevant CI before merge. The immutable v3.1.16 tag stays at 8e21742. After merge, dispatch a new preparation run from main against that unchanged candidate and v3.1.15 previous stable, bootstrap_catalog=false. Evidence will distinguish workflow SHA from firmware candidate. The failed run created no draft assets and no scale was flashed.

@ODevStudio
ODevStudio merged commit a8db8fb into main Nov 8, 2026
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